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New Electronics Packaging and Assembly |
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- Fine Pitch Assembly, Ball Grid Array, Flip Chip and Chip Scale Package (micro BGA)
- Chip-On-Glass (COG), Chip-On-Flex (COF)
- Soft-beam selective soldering for double-side COF and SMT
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- Training, consultation and reliability testing services are provided to help companies adopt the lead-free process and assure the quality of electronic assemblies
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Mr Daniel Chan
Tel: (852) 2788 5738
E-mail: daniel@hkpc.org |
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