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Advanced Electronics Processing Technology Centre

Introduction

HKPC's Advanced Electronics Processing Technology Centre provides services in the areas of electronics manufacturing, including SMT, BGA, Flip Chip, CSP, Build-up PCB, IPC-9151 and lead-free soldering. The services include consultancy, in-class & in-company training, small batch prototype assembly, materials analysis and green product design.

Advanced Electronics Processing Technology Centre equipment
Advanced Electronics Processing Technology Centre equipment

Objectives

  • To assist local industries to upgrade their capabilities in the manufacturing of advanced electronics products through the adoption of new printed circuit board assembly technology such as advanced Surface Mount Assembly (SMT), Flip-Chip Attach, Chip-Scale Packaging, Chip-On-Glass, Chip-On-Flex and Lead-free Soldering
  • To enhance the productivity of local industries in printed circuit board assembly processes by disseminating new production techniques
  • To promote technology and business partnership among electronics manufacturers in Hong Kong, the Mainland and overseas

Services

Flip Chip Assembly and Chip Scale Packaging Assembly Technology

Introduction

With funding support from the Innovation and Technology Fund (ITF), HKPC promotes and transfers the Flip-Chip Attach technology to local industry. Through dissemination of the technology and its development trends, manufacturers are able to acquire the problem-solving know-how, assimilate and implement the technology into their products and assembly lines. A complete line for flip chip on PCB assembly has been installed at HKPC for demonstration and prototype assembly services. The line consists of:

  • MPM SPM-AV Stencil Printer
  • SIEMENS SIPLACE 80F+ Pick & Place Machine
  • ELECTROVERT OMNIFLO 5 Reflow System
  • CAMALOT 1818 Underfill System
  • SIERRA SUMMIT 1000 Precision Rework Station
Flip Chip Assembly and Chip Scale Packaging Assembly Technology
Flip Chip Assembly and Chip Scale Packaging Assembly Technology


Applications

Miniature electronic products

Target Industry

Consumer electronics and telecommunications

Consultancy/Testing Fee

Please contact us for details on service charges

Contact Details

Mr Norton Yuen
Tel: (852) 2788 6064
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

Lead-free Soldering Technology

Introduction

HKPC has completed an ITF project on Lead-free Soldering technology to:

  • Demonstrate and transfer Lead-free Soldering Technology to the local electronics industry;
  • Assist local companies to adopt this technology in their manufacturing process;
  • Provide prototype assembly and technical support;
  • Liaise with international organizations to keep abreast of the latest development in legislation on lead-free components.

HKPC is equipped with a complete set of production equipment for lead-free soldering. The quality and reliability of lead-free solder joints can be evaluated at the analytical and reliability laboratories of HKPC.

Lead-free Soldering Technology
Lead-free Soldering Technology


Applications

Electronic components and products

Target Industry

Electronic component and product manufacturers

Consultancy/Testing Fee

Please contact us for details on service charges

Contact Details

Ms Angel Wong
Tel: (852) 2788 5783
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

Mr Norton Yuen
Tel: (852) 2788 6064
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

Printed Circuit Assembly (SMT) Prototyping

Introduction

HKPC's Advanced Electronics Processing Technology Centre (AEPTC) supports local industry in advanced surface mount printed circuit board assembly (PCBA) technologies and small batch prototyping. The machines at the Centre can handle assembly of fine pitch components such as micro-BGA, CSP, and 0402 devices. The Centre also provides consultation and in-company training on PCBA process improvement.

Printed Circuit Assembly (SMT) Prototyping
Printed Circuit Assembly (SMT) Prototyping


Applications

Electronic products

Target Industry

Consumer electronics, toys, electrical appliances, telecommunications and computer & peripherals

Consultancy/Testing Fee

Please contact us for details on service charges

Contact Details

Mr Norton Yuen
Tel: (852) 2788 6064
E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.

Facilities

  • Stencil Printer (MODEL:SPM)
  • Pick & Place Machine (MODEL: SIEMEN'S SIPLACE 80F+)
  • Underfill System (MODEL: CAMALOT 1818)
  • SMT Rework Station (MODEL: SIERRA SUMMIT 1000)
  • Reflow Soldering System (MODEL: ELECTROVERT OMNIFLO 5)
  • Lead-free Hot Air Reflow Soldering System (MODEL: SUN EAST NT-4007)
  • Lead-free Wave Soldering System (MODEL: SUN EAST SAC-35S)

Case Studies

Lead-free Soldering