HKPC Signs MoU with Slovak National Innovation and Technology Centre to Drive Innovation and Technology Development and Cultivate Talent

(Hong Kong, 22 September 2025) The Hong Kong Productivity Council (HKPC) and the Slovak National Innovation and Technology Centre of Slovakia (NITC) have signed a Memorandum of Understanding (MoU) to strengthen bilateral cooperation in innovation and technology (I&T). The MoU aims to leverage the respective strengths and business connections of both parties to forge closer ties in I&T development, while facilitating talent development and Go Global for mutual benefit.

The signing ceremony, held as part of a delegation visit co-organised by the Office of the Deputy Prime Minister of Slovakia and the Honorary Consulate of the Slovak Republic in Hong Kong, marks a significant step in fostering cross-border partnerships and advancing innovation and technology development. In addition to HKPC, senior representatives from the Hong Kong Economic and Trade Office, Berlin, the Hong Kong Applied Science and Technology Research Institute, the Hong Kong Science and Technology Parks Corporation, and the Hong Kong Trade Development Council also participated in the visit. Together, they highlighted the city’s cutting-edge innovation capabilities.

Mr Mohamed D. Butt, Executive Director of HKPC, said, “This collaboration represents a milestone in strengthening Hong Kong’s position as an international innovation and technology centre. By combining HKPC's expertise with Slovakia’s dynamic innovation ecosystem, we can create synergies that drive technological advancement and nurture talent, building a robust platform for innovation and business opportunities. We are pleased to contribute to the I&T ecosystem in Slovakia while creating more opportunities for Hong Kong businesses.”

Dr Juraj Miskov, President and CEO of NITC, said, “We are very excited about this new journey. HKPC’s expertise in leveraging innovation and technology, market-driven R&D, and advanced manufacturing services will bring great benefits to NITC and strengthen competitiveness in Slovakia. We are confident that our collaboration will foster innovative solutions, support bidirectional Go Global initiatives, and deliver significant achievements for both Hong Kong and Slovakia.”

The collaboration between the two parties in the following four major areas will enable businesses to expand their global impact, seize new opportunities, and enhance their competitiveness:

• Support for Slovakia’s Innovation and Technology Development Programme: NITC may engage HKPC for consultancy and advisory services, leveraging HKPC’s expertise and business model to enhance Slovakia’s I&T initiatives.
• Promotion of HKPC’s InnoTalent Programme: The parties will jointly promote and recruit Slovakian university students for HKPC’s InnoTalent Programme, a summer and winter internship initiative, with potential return offers for graduates to join HKPC.
• Support for Bidirectional Go Global Initiatives: The parties will facilitate mutual business missions, business matching, and provide insights into local government regulations, technology standards, and support programmes to advance their respective Go Global initiatives.
• Identification of Partners for Advanced Technology Research: NITC will assist HKPC in sourcing R&D institutes for joint technology development projects and collaborate to secure funding from various sources.
   

During the delegation visit, HKPC participated in the SlovakiaTech Forum-Expo 2025 in Košice, showcasing Hong Kong’s vibrant innovation and technology ecosystem. Additionally, HKPC engaged in discussions with the Slovak Academy of Sciences and the Technical University of Košice to explore potential collaboration opportunities with Hong Kong. As a nationwide leader in innovative, market-driven research and development internationally, HKPC will continue to serve as a 'super connector,' linking Hong Kong with global partners and deepening international collaboration among government, industry, academia, and research.

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Witnessed by Mr Peter Kmec, Deputy Prime Minister of Slovakia (second from the right), and Mr Andrej Hutta, Vice-President of the Federation of Employers' Associations (AZZZ) in Slovakia (first from the right), the Memorandum of Understanding was signed by Mr Mohamed D. Butt, Executive Director of HKPC (second from the left), and Dr Juraj Miskov, President and CEO of NITC (first from the left), to strengthen bilateral cooperation in I&T.

Mr Mohamed D. Butt, Executive Director of HKPC (first from the right) attended the SlovakiaTech Forum-Expo 2025 to discuss how the state and the private sector can collaborate to promote the innovative performance of the economy.