Advanced Electronics Processing Technology Centre
Introduction
HKPC's Advanced Electronics Processing Technology Centre provides services in the areas of electronics manufacturing, including SMT, BGA, Flip Chip, CSP, Build-up PCB, IPC-9151 and lead-free soldering. The services include consultancy, in-class & in-company training, small batch prototype assembly, materials analysis and green product design, surface mount accuracy and stability test.
Advanced Electronics Processing Technology Centre equipment
Objectives
- To assist local industries to upgrade their capabilities in the manufacturing of advanced electronics products through the adoption of new printed circuit board assembly technology such as advanced Surface Mount Assembly (SMT), Flip-Chip Attach, Chip-Scale Packaging, Chip-On-Glass, Chip-On-Flex and Lead-free Soldering
- To enhance the productivity of local industries in printed circuit board assembly processes by disseminating new production techniques
- To promote technology and business partnership among electronics manufacturers in Hong Kong, the Mainland and overseas
Services
Flip Chip Assembly and Chip Scale Packaging Assembly Technology
Introduction
With funding support from the Innovation and Technology Fund (ITF), HKPC promotes and transfers the Flip-Chip Attach technology to local industry. Through dissemination of the technology and its development trends, manufacturers are able to acquire the problem-solving know-how, assimilate and implement the technology into their products and assembly lines. A complete line for flip chip on PCB assembly has been installed at HKPC for demonstration and prototype assembly services. The line consists of:
- MPM SPM-AV Stencil Printer
- SIEMENS SIPLACE 80F+ Pick & Place Machine
- ELECTROVERT OMNIFLO 5 Reflow System
- CAMALOT 1818 Underfill System
- SIERRA SUMMIT 1000 Precision Rework Station
Flip Chip Assembly and Chip Scale Packaging Assembly Technology
Applications
Miniature electronic products
Target Industry
Consumer electronics and telecommunications
Consultancy/Testing Fee
Please contact us for details on service charges
Contact Details
Mr Norton Yuen
Tel: (852) 2788 6064
E-mail: nortonyuen@hkpc.org
Lead-free Soldering Technology
Introduction
HKPC has completed an ITF project on Lead-free Soldering technology to:
- Demonstrate and transfer Lead-free Soldering Technology to the local electronics industry;
- Assist local companies to adopt this technology in their manufacturing process;
- Provide prototype assembly and technical support;
- Liaise with international organizations to keep abreast of the latest development in legislation on lead-free components.
HKPC is equipped with a complete set of production equipment for lead-free soldering. The quality and reliability of lead-free solder joints can be evaluated at the analytical and reliability laboratories of HKPC.
Lead-free Soldering Technology
Applications
Electronic components and products
Target Industry
Electronic component and product manufacturers
Consultancy/Testing Fee
Please contact us for details on service charges
Contact Details
Ms Angel Wong
Tel: (852) 2788 5783
E-mail: angel@hkpc.org
Mr Norton Yuen
Tel: (852) 2788 6064
E-mail: nortonyuen@hkpc.org
Printed Circuit Assembly (SMT) Prototyping
Introduction
HKPC's Advanced Electronics Processing Technology Centre (AEPTC) supports local industry in advanced surface mount printed circuit board assembly (PCBA) technologies and small batch prototyping. The machines at the Centre can handle assembly of fine pitch components such as micro-BGA, CSP, and 0402 devices. The Centre also provides consultation and in-company training on PCBA process improvement.
Printed Circuit Assembly (SMT) Prototyping
Applications
Electronic products
Target Industry
Consumer electronics, toys, electrical appliances, telecommunications and computer & peripherals
Consultancy/Testing Fee
Please contact us for details on service charges
Contact Details
Mr Norton Yuen
Tel: (852) 2788 6064
E-mail: nortonyuen@hkpc.org
Facilities
- Stencil Printer (MODEL:SPM)
- Pick & Place Machine (MODEL: SIEMEN'S SIPLACE 80F+)
- Underfill System (MODEL: CAMALOT 1818)
- SMT Rework Station (MODEL: SIERRA SUMMIT 1000)
- Reflow Soldering System (MODEL: ELECTROVERT OMNIFLO 5)
- Lead-free Hot Air Reflow Soldering System (MODEL: SUN EAST NT-4007)
- Lead-free Wave Soldering System (MODEL: SUN EAST SAC-35S)
