Advanced Electronics Processing Technology Centre

Introduction

HKPC's Advanced Electronics Processing Technology Centre provides services in the areas of electronics manufacturing, including SMT, BGA, Flip Chip, CSP, Build-up PCB, IPC-9151 and lead-free soldering. The services include consultancy, in-class & in-company training, small batch prototype assembly, materials analysis and green product design, surface mount accuracy and stability test.

Advanced Electronics Processing Technology Centre equipment

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Objectives

To assist local industries to upgrade their capabilities in the manufacturing of advanced electronics products through the adoption of new printed circuit board assembly technology such as advanced Surface Mount Assembly (SMT), Flip-Chip Attach, Chip-Scale Packaging, Chip-On-Glass, Chip-On-Flex and Lead-free Soldering
To enhance the productivity of local industries in printed circuit board assembly processes by disseminating new production techniques
To promote technology and business partnership among electronics manufacturers in Hong Kong, the Mainland and overseas

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Services

Flip Chip Assembly and Chip Scale Packaging Assembly Technology

Introduction

With funding support from the Innovation and Technology Fund (ITF), HKPC promotes and transfers the Flip-Chip Attach technology to local industry. Through dissemination of the technology and its development trends, manufacturers are able to acquire the problem-solving know-how, assimilate and implement the technology into their products and assembly lines. A complete line for flip chip on PCB assembly has been installed at HKPC for demonstration and prototype assembly services. The line consists of:

MPM SPM-AV Stencil Printer
SIEMENS SIPLACE 80F+ Pick & Place Machine
ELECTROVERT OMNIFLO 5 Reflow System
CAMALOT 1818 Underfill System
SIERRA SUMMIT 1000 Precision Rework Station

Flip Chip Assembly and Chip Scale Packaging Assembly Technology

Applications

Miniature electronic products

Target Industry

Consumer electronics and telecommunications

Consultancy/Testing Fee

Please contact us for details on service charges

Contact Details

Mr Li Kwan Tai
Tel: (852) 2788 5793
E-mail: ktli@hkpc.org

Lead-free Soldering Technology

Introduction

HKPC has completed an ITF project on Lead-free Soldering technology to:

Demonstrate and transfer Lead-free Soldering Technology to the local electronics industry;
Assist local companies to adopt this technology in their manufacturing process;
Provide prototype assembly and technical support;
Liaise with international organizations to keep abreast of the latest development in legislation on lead-free components.

HKPC is equipped with a complete set of production equipment for lead-free soldering. The quality and reliability of lead-free solder joints can be evaluated at the analytical and reliability laboratories of HKPC.

Lead-free Soldering Technology

Applications

Electronic components and products

Target Industry

Electronic component and product manufacturers

Consultancy/Testing Fee

Please contact us for details on service charges

Contact Details

Mr Li Kwan Tai
Tel: (852) 2788 5793
E-mail: ktli@hkpc.org

Printed Circuit Assembly (SMT) Prototyping

Introduction

HKPC's Advanced Electronics Processing Technology Centre (AEPTC) supports local industry in advanced surface mount printed circuit board assembly (PCBA) technologies and small batch prototyping. The machines at the Centre can handle assembly of fine pitch components such as micro-BGA, CSP, and 0402 devices. The Centre also provides consultation and in-company training on PCBA process improvement.