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Four HKPC I&T Inventions Win TechConnect 2023 Innovation Awards

(Hong Kong, 10 May 2023) The Hong Kong Productivity Council (HKPC) has garnered a record-breaking of four Innovation Awards at the TechConnect World Innovation Conference and Expo 2023 (TechConnect), which fully recognises HKPC’s world-class R&D capabilities and efforts to promote practical applications and commercialisation of innovative technologies.

For over 20 years, TechConnect has been one of the most globally-recognised multi-sector R&D signature events uniquely designed to accelerate the commercialisation of innovations out of the lab and into industry, while the TechConnect Innovation Awards recognise the top technologies based on the potential positive impact in various technological areas and society. More than 90 organisations across the globe submitted over 170 applications this year. Gathering global scientific R&D elites to exchange their R&D results, the event awarded innovators from renowned research institutes, laboratories and universities around the world, such as Stanford University, University of Pennsylvania-Penn Center for Innovation, the Australian National University, Korea Institute of Energy Research (KIER), Ames National Laboratory — a US Department of Energy National Laboratory, and other global technology enterprises focusing on cutting-edge fields including life and health, semi-conductors, cyber security, renewable energy, and deep-sea exploration.

Mr Mohamed BUTT, Executive Director of HKPC, said, “We are very honoured that HKPC’s innovations have won the TechConnect Innovation Awards three years in a row among top innovators worldwide. Among the four awardees, we are pleased to know HKPC’s indigenous smart manufacturing innovation has been recognised by the world’s leading experts. And the R&D achievements jointly developed by HKPC with our partners and clients have also received this prestigious international the successful award. These projects have resulted in the successful application of advanced technologies such as artificial intelligence (AI) & robotics and augmented reality (AR), enhancing industry competitiveness and reaffirming the importance of collaboration among the Government, industry, academic and research sectors for Hong Kong’s development into an international innovation and technology (I&T) centre. HKPC will continue providing more I&T solutions, deepen the cooperation and exchange with leading research partners at home and overseas, foster the commercialisation of technologies and promote the “from 1 to N” transformation of R&D outcomes to address the pain points of our clients from all industries, while helping them achieve upgrading and transformation. All these efforts will serve to promote new industrialisation and I&T development in Hong Kong.”

HKPC’s four innovations that won TechConnect 2023 Innovation Awards include:
Four HKPC I&T Inventions Win TechConnect 2023 Innovation Awards

For more information, please refer to the official list of TechConnect 2023 Innovation Awardees at

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