SMT Package Assembly Compatibility Testing Service

Name of the Client

Semiconductor Industry 

Client's Profile

A NASDAQ listed semiconductor manufacturer with operations in more than 25 countries 

Client's Needs

Footprint testing for new package components, product issue evaluation, and component packing handling testing. 

Our Solutions

HKPC provides testing which simulate actual manufacturing process in production plants. HKPC evaluates production performance of the new package components, to enhance the performance and reliability of their new and existing packaging design.

Value Created
  • Client has enough support in proofing the design of packages with data.
  • Client could provide suitable Printed Circuit Board (PCB) pads design suggestions for electronic manufacturers in their application notes.
  • Shorten test lead time and allow client to focus on their package design and development