HKPC Develops Diffusion Bonding to Enhance the Capabilities of Local Manufacturers in Moulding and Tooling

To enhance the capabilities of local manufacturers in the production of quality plastic products with improved precision, the Hong Kong Productivity Council (HKPC), with funding support from the Innovation and Technology Fund of the HKSAR Government, has developed a method to apply diffusion bonding to the incorporation of complicated cooling channels in moulds.

According to Dr L K Yeung, General Manager (Materials Technology) of HKPC, diffusion bonding is a solid-state joining technique that utilizes high heat and pressure to join up solid blocks of metal and/or ceramic under vacuum condition. As compared with soldering, diffusion bonding results in stronger joints and less distortion.

"This technology is especially useful for mould manufacturers. It can help them minimize the risk of material deformation, through improved thermal control in the plastic injection process, thus enabling them to produce quality plastic products with improved precision," Dr Yeung said.

"Through the consultancy services offered by HKPC, we have assisted a number of companies from different sectors, ranging from plastic products to electrical appliances, to apply diffusion bonding to achieve higher production speed and lower scrap rate," he added.

For further information about the technology, please contact Mr Raymond Chan of HKPC at tel. (852) 2788 5506 or e-mail: mkchan@hkpc.org.

For media enquiries, please contact:
Ms Betty Lee
General Manager
Corporate Communications and Events
Tel: (852) 2788 5036
Fax: (852) 2788 5056
E-mail: emilyc@hkpc.org
Website: www.hkpc.org

HKPC
14 July 2006

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